Heat-Dissipating Device For Memory And Method For Manufacturing The Same

ABSTRACT

A heat-dissipating device for a memory and a method for manufacturing the same are disclosed herein. A primary feature is to provide an integrally manufactured heat sink. The heat sink is made of a metal plate with a certain thickness. A plurality of protrusions is provided on one side of the heat sink. Part of the other side of the heat sink is a flat surface. The flat surfaces of the two heat sinks are in contact with both sides of the memory. A clamping member holds these two heat sinks at both sides of the memory.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat-dissipating device for a memoryand a method for manufacturing the same.

2. The Prior Arts

With the increase of performance, heat has become a big issue withelectronic components. Both the performance reliability and lifeexpectancy of electronic components are inversely related to thecomponent temperature. At present a casing of memory on the market ismade of metal, which are brought into contact with the hot surface of anintegrated circuit memory chip. Therefore, the metal casing transfersthe memory chip's heat over a larger area enabling it to give up itsheat to the surrounding air more quickly. The metal casing works as aheat-dissipating device for the conventional memory.

Referring to FIGS. 8 and 9, a conventional heat-dissipating device for amemory comprises two heat sinks A1 and A2 formed of sheet metal, whichare symmetrically held in place at both sides of the memory B by a clipor a locking device, such that each chip on the memory B contacts withthe heat sinks A1 and A2. Generally, the casing of the conventionalmemory, i.e. the heat sink, is sheet metal punched into thin groovedpiece, so as to increase the surface area and enhance the strength ofthe sheet metal. The increase of the surface area is very limited bythis way, and the thin sheet metal cannot be punched to have combs orfins thereon as conventional extruded aluminum heat sinks. Some heatsinks are made by attaching an array of metal combs or fin likeprotrusions onto the sheet metal with adhesive to increase the surfacethat are in contact with the air just like the extruded aluminum heatsink does. However, because the sheet metal and the combs or fins arenot integrally manufactured, a layer of thermally conductive glue isadded to bond the combs or fins onto the grooved sheet metal. It isimpossible to achieve the best effect of heat transferring.

Of course, the conventional memory can utilize the extruded heat sink todissipate the heat, but the fins on the extruded product are continuousfrom end to end. Before a clip is used to affix the heat sinks tightover the memory, it is necessary to remove part of the fins by machiningsuch that a space can be provided for the clip. It makes themanufacturing process complicated and the manufacturing cost higher.

Furthermore, extrusion is a manufacturing process to create long objectsof a fixed cross-section, so the fins can only be extruded as longridges along the extruding direction. The fins cannot be extruded asridges perpendicular to the extruding direction. The fins cannot beformed as an array of combs or raised dots either.

SUMMARY OF THE INVENTION

A technical problem to be solved according to the present invention isthat a casing of a conventional memory heat-dissipating device is formedof a punched thin sheet metal. Since punching cannot form combs or fins,they must be attached to the thin sheet metal by adhesive. Therefore,the manufacturing process becomes more complicated, and the heattransfer efficiency cannot be further improved.

Another technical problem to be solved according to the presentinvention is that a conventional memory heat-dissipating device is onlya thin sheet metal. The mass of the heat-dissipating device also playsan important part for transferring heat from the memory. The greater themass of the heat-dissipating device has, the more heat that can beremoved and stored. The mass of the steel metal is limited, so the heattransfer efficient is poor.

Furthermore, if a conventional memory heat-dissipating device uses anextruded heat sink, it is necessary to remove part of the fins bymachining such that a space can be provided for the clip. As such, themanufacturing process is more complicated, and the manufacturing cost ishigher.

A primary technical feature of the present invention is to provide athicker heat sink of metal plate manufactured integrally, wherein oneside of the heat sink has a plurality of vertical protrusions and theother side is a flat surface. The flat surfaces of two heat sinks are incontact with both sides of a memory respectively. The heat sinks areheld in place at both sides of the memory by a clip or locking device.The heat sinks store the heat by thicker plate and remove the heat byvertical protrusions. Thus the heat transfer efficiency is improved.

Another technical feature of the present invention is to provide theheat sink made of a copper plate, an aluminum plate, or the like, andthen manufactured by forging, powder metallurgy, casting and extrusiondepending on the characteristics of the materials. A plurality ofprotrusions is on one side of the heat sink. The protrusions may beraised dots, fins, combs, or any objects perpendicular to the metalplate.

Part of the other side of the heat sink is provided with a flat portionto be in contact with the memory. Two flat surfaces of two heat sinksare in contact with both sides of the memory, and held in place by aclip or locking device.

The aforementioned method and the heat-dissipating device of the presentinvention can integrally form a plurality of protrusions such as raiseddots, combs, fins or the like on a thicker metal plate. It not onlyincreases the heat-dissipating area of the heat sink, but also improvesthe efficiency of heat dissipating. The manufacturing process issimplified and the manufacturing cost is reduced.

The present invention will be apparent to those skilled in the art byreading the following detailed description of a preferred embodimentthereof, with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing a first embodiment inaccordance with the present invention.

FIG. 2 is an assembled perspective view showing the first embodiment inaccordance with the present invention.

FIG. 3 is an exploded perspective view showing a second embodiment inaccordance with the present invention.

FIG. 4 is an assembled perspective view showing the second embodiment inaccordance with the present invention.

FIG. 5 is an exploded perspective view showing a third embodiment inaccordance with the present invention.

FIG. 6 is an assembled perspective view showing the third embodiment inaccordance with the present invention.

FIG. 7 is a cross-sectional view showing the structure of a heat sink inaccordance with the present invention.

FIG. 8 is an exploded perspective view showing the assemblingrelationship of a conventional heat sink and a memory.

FIG. 9 is a perspective view showing a conventional heat sink and amemory after they are assembled.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 is an exploded perspective view illustrating a first embodimentof a heat-dissipating device 1 used for a memory 2 according to thepresent invention. The heat-dissipating device 1 comprises two heatsinks 11, which is made of material with high thermal conductivity suchas copper or aluminum. The heat sink 11 has a plurality of protrusionson one side. In the first embodiment, the protrusions are combs 12A.They can also be shorter in length or in spherical shapes such as raiseddots (not shown). Part of the other side of the heat sink 11 is a flatsurface 15. The thickness of the heat sink is not necessary to beuniform. The shape of the heat sink can be a cube, a grooved plate withraised edges or the like. A plurality of extended edges 16 extendsvertically from one edge of the heat sink 11 towards the flat surface15. The extended edges 16 of the two heat sinks 11 are staggered in sucha manner that they can be fitted complementarily together. In order tofix the two heat sinks 11 together, a fixation space 13 is left betweenthe combs 12A for mounting a clamping member 3, and has a locking wedge14 thereon.

The memory 2 generally comprises a circuit board, and a plurality ofchips 21 disposed on the circuit board. The package of the memorycomprises a plurality of electrical connecting pins 22. The two heatsinks 11 mentioned above are symmetrically arranged at both sides of thememory 2. The flat surfaces 15 of both the heat sinks 11 are in contactwith both sides of the memory 2 respectively. And then, the U-shapedclamping member 3 clamps on the fixation spaces 13 of the two heat sinks11. The locking wedges 14 on the fixation space 13 are inserted into thelocking holes 31 at both sides of the clamping member 3 to make a joint.Therefore the two heat sinks 11 are held at both sides of the memory 2.The assembled memory and heat sinks are shown in FIG. 2.

Referring to FIGS. 3 and 4, the protrusions on the heat sink 11 are aplurality of fins 12B that are parallel with the length direction (i.e.the axial direction) of the heat sink 11 according to a secondembodiment of the present invention. The fixation spaces 13 separate theaxial fins 12B into a plurality of partitions. The clamping members 3Baccording to the second embodiment are clips, which are used to hold thetwo heat sinks 11 at both sides of the memory 2.

Referring to FIGS. 5 and 6, the protrusions on the heat sink 11 are aplurality of fins 12C that are perpendicular to the length direction(i.e. the lateral direction) of the heat sink 11 according to a thirdembodiment of the present invention. The fixation space 13 separates thelateral fins 12C into a plurality of partitions. The fixation space 13according to the third embodiment is provided with a clip as theclamping member 3B to hold the two heat sinks 11 at both sides of thememory 2.

The various heat sinks 11 in accordance with the aforementionedembodiments of the present invention are integrally manufactured.Referring to FIG. 7, the heat sinks 11 are made of plates withappropriate thickness H to store heat. The heat is transferred to theprotrusions and then dissipated into the surrounding environment,thereby achieving an excellent heat-dissipating effect. If heat sinks 11are made of copper, the manufacturing process can be forging, powdermetallurgy, extrusion or the like. If the heat sinks 11 are made ofaluminum, the manufacturing process can be forging, casting, extrusionor the like.

Although the present invention has been described with reference to thepreferred embodiments thereof, it is apparent to those skilled in theart that a variety of modifications and changes may be made withoutdeparting from the scope of the present invention which is intended tobe defined by the appended claims.

1. A method for manufacturing a heat-dissipating device for a memory,comprising the step of integrally forming a plurality of protrusions onone side of a metal plate and a flat portion on the other side of themetal plate, thus forming a heat sink.
 2. The method as claimed in claim1, wherein said protrusions are raised dots.
 3. The method as claimed inclaim 1, wherein said protrusions are combs.
 4. The method as claimed inclaim 2, wherein said metal plate is made of copper and formed byforging.
 5. The method as claimed in claim 3, wherein said metal plateis made of copper and formed by forging.
 6. The method as claimed inclaim 2, wherein said metal plate is made of copper and formed by powdermetallurgy.
 7. The method as claimed in claim 3, wherein said metalplate is made of copper and formed by powder metallurgy.
 8. The methodas claimed in claim 2, wherein said metal plate is made of aluminum andformed by forging.
 9. The method as claimed in claim 3, wherein saidmetal plate is made of aluminum and formed by forging.
 10. The method asclaimed in claim 2, wherein said metal plate is made of aluminum andformed by casting.
 11. The method as claimed in claim 3, wherein saidmetal plate is made of aluminum and formed by casting.
 12. The method asclaimed in claim 1, wherein said protrusions are fins.
 13. The method asclaimed in claim 12, wherein said metal plate is made of copper andformed by forging.
 14. The method as claimed in claim 12, wherein saidmetal plate is made of aluminum and formed by forging.
 15. The method asclaimed in claim 12, wherein said metal plate is made of copper andformed by extrusion.
 16. The method as claimed in claim 12, wherein saidmetal plate is made of aluminum and formed by extrusion.
 17. Aheat-dissipating device for a memory, comprising two heat sinks, whereineach of said heat sinks is integrally manufactured with a metal plate,one side of said metal plate is provided with a plurality ofprotrusions, the other side of said metal plate has a flat portion, saidflat portions of said two heat sinks are in contact with both sides ofsaid memory, and a clamping member fixes said heat sinks at both sidesof said memory.